• Responsibilities • Drive new product and new process development to ensure timely and successful delivery of qualified products. • Oversee day-to-day progress of matrix lots to keep development activities on track. • Manage part numbers and BOM to ensure proper setup for new product introduction. • Support the NPI team in establishing mask sets, process flows, and workflows for both front-end (wafer fabrication) and back-end (die assembly and characterization) processes. • Assist in failure analysis by investigating issues found during wafer fabrication and product characterization and take the lead in analyzing root causes. • Coordinate production ramp-up readiness by working closely with cross-functional teams—including EPI, process, assembly, test, and product engineering—to ensure readiness in areas such as chip design/specs, equipment, process documentation, and data infrastructure. • Collaborate with the product engineering team to improve yield, especially in addressing characterization issues that span multiple process areas. • Design and execute experiments related to design, process, and testing to identify and implement corrective actions for failure modes encountered during new product development. • Experience • 3 years of experience in III-V semiconductor laser related device design, process development and characterization is required. • PhD degree in electrical engineering, material science, physics, or other relevant major. • Skills & requirements • Hands-on experience with design, process and characterization of optoelectronic device such as VCSEL, DFB laser, or photonic integrated chip. • Strong statistical data analysis skills (JMP or Minitab etc.). • Familiarity with semiconductor wafer fab operations (Manufacturing Execution System, process and quality control, change management etc.). • Experience with optoelectronic device reliability testing and modeling is a plus. • Strong communication skills; adept at hosting effective meetings and facilitating actions and resolving conflicts. • Strong ability to drive actions and solutions through cross-functional teams. • Collaborate in a professional and respectful manner with coworkers, vendors, contractors, etc. • Oversee new product and process development, ensuring timely qualification and launch. • Manage day-to-day progress of development activities, keeping projects on track. • Support NPI team in establishing mask sets, process flows, and workflows for front-end and back-end processes. • Lead failure analysis, investigating issues during fabrication and characterization. • Coordinate production ramp-up with cross-functional teams, ensuring readiness in all areas. • Collaborate with product engineering to improve yield and address characterization issues. • Design and execute experiments to identify and correct failure modes. • Manage part numbers and BOM for new product introductions. • Ensure proper setup and documentation for smooth transition to manufacturing. • PhD in Electrical Engineering, Material Science, Physics, or related field. • 3+ years of experience in III-V semiconductor laser device design, process development, and characterization. • Hands-on experience with optoelectronic device design, process, and characterization (VCSEL, DFB laser, etc.). • Strong statistical data analysis skills (JMP, Minitab, etc.). • Familiarity with semiconductor wafer fab operations and processes. • Experience with optoelectronic device reliability testing is an asset. • Excellent communication skills, able to lead meetings and resolve conflicts. • Proven ability to drive cross-functional teams and actions. • Professional and respectful collaboration with colleagues and external partners. • Ability to work in a cleanroom environment and with hazardous materials.