Legrand has an exciting opportunity for an Electrical Engineering Supervisor to join the Power and Thermal Management team in Reno, NV. Under general direction of the Senior Electrical Engineering Manager, the Electrical Engineering Supervisor will supervise the technical activities and projects within the Electrical Engineering Group, and independently design and draft layout for complex printed circuit boards (PCBs) with high voltage/current analog sensors in addition to microprocessor controlled digital circuits. The Electrical Engineering Supervisor will collaborate with the Principal Electrical Engineer on new system architecture, analog and digital circuit designs, for the company’s next generation products. Electrical Engineering Supervisor may be assigned complex tasks requiring greater knowledge and skill. The Senior Electrical Engineering Supervisor will ensure that all assigned duties are performed quickly, efficiently and according to the established departmental and company policies, procedures and goals. • Supervise project and technical activities within the Electrical Engineering Group. • Work with the Principle Electrical Engineer and provide technical support to the EE Team. • Supervise the Engineering Lab activities and manage the lab and Intern staff. • Provide weekly project status and employee performance feedback to the Senior Electrical Engineering Manager. • Maintain and create engineering documentation and procedures. • PCB design/layout with high voltage/current analog sensors in addition to microprocessor controlled digital and analog circuits. • Prepare power distribution and switching designs (AC/DC up to 1200V). • Perform mixed signal design. • Coordinate design updates with Engineering Services to execute implementation plans. • Design using Embedded Microcontrollers. • Research new technology to enhance Power, Access and Control (PAC) products. • Review RMAs & identify systemic field failures requiring engineering research & resolution. • Create detailed system level specifications for PAC products and printed circuit board assemblies. • Prioritize the rollout of circuit updates to existing products. • Provide technical support to partner companies doing design and development work for PAC. • Perform/direct Root Cause Analysis and recommend design enhancements. • Promote positive company user relations by projecting a courteous, helpful attitude and assisting employees when appropriate. • Display original thinking and creativity; Meet challenges with resourcefulness; Generate suggestions for improving work; develop innovative approaches and ideas. • Display willingness to make decisions; exhibit sound and accurate judgment; support and explain reasoning for decisions; include appropriate people in decision-making process (specifically department managers); make timely decisions. • Perform other duties as assigned. Education: • Bachelor's degree from four-year College or University with emphasis in Electrical Engineering or comparable experience or related field; or equivalent combination of education and experience. Experience: • A minimum of 5 years’ experience in similar industry; high density product packaging design experience a plus; PCB design/layout experience using ECAD tools (Altium Designer experience preferred); previous experience with analog/digital/power design. Skills/Knowledge/Abilities: • Strong technical leadership skills • Strong knowledge of IPC standards. • Ability to design and troubleshoot PCB board designs of a complex nature. • Effective oral and written communication skills with the ability to provide information across multiple groups in the Company including Engineering, Marketing, and Sales. • Exceptional organizational and planning skills and the ability to work independently. • Project management skills include planning, organizing, and coordinating tasks. • Computer proficient with knowledge of Microsoft Office products (Word/Excel/Outlook). • Familiarity with ISO 9000 standards and audit process.