Piper Companies is seeking a Senior Substrate Design Layout Engineer to support an industry‑leading semiconductor organization for a permanent, onsite opportunity based in Saratoga, CA. The Senior Substrate Design Layout Engineer will contribute to the development and layout of cutting‑edge organic substrate solutions for next‑generation multi‑die and chiplet computing platforms. Responsibilities of the Senior Substrate Design Layout Engineer include: · Lead detailed layout activities for complex organic substrates, including bump planning, routing schemes, and multilayer stack‑up development. · Define routing and power‑delivery strategies that support high‑speed interfaces and high‑current architectures across advanced package substrates. · Collaborate closely with integration, silicon, SI/PI, and mechanical teams to ensure cohesive co‑design and layout feasibility. · Evaluate design risks early in development and recommend layout‑driven improvements to meet electrical, mechanical, and manufacturability constraints. · Interface with substrate suppliers and OSAT partners to validate design readiness, manufacturability, and overall yield performance. Qualifications for the Senior Substrate Design Layout Engineer include: · 10+ years of experience in advanced organic substrate design or high‑performance IC package layout. · Background working with multi‑die, chiplet, or high‑density module architectures using ABF and multilayer organic technologies. · Proficiency in Siemens Xpedition (preferred) and experience with tools such as Cadence Allegro/APD. · Hands‑on experience collaborating with OSATs and global substrate vendors, including driving designs through tape‑out. · Strong understanding of SI/PI concepts, HDI structures, and routing practices supporting high‑speed signals and advanced power delivery networks. Compensation for the Senior Substrate Design Layout Engineer: Salary Range: $235,000-$265,000/year (USD) Comprehensive Benefits: Medical, Dental, Vision, sick leave if required by law, and 401K This job opens for applications on 10/30/26. Applications for this job will be accepted for at least 30 days from the posting date. Keywords: substrate design, organic packaging, advanced packaging, chiplet integration, multi‑die modules, ABF substrates, Siemens Xpedition, Allegro APD, OSAT, HDI routing, SI/PI, high‑speed interfaces, power delivery networks, PCB layout, co‑design, semiconductor packaging, bump planning, escape routing, stack‑up design, manufacturability, high‑density routing, tape‑out. #LI-MB1 #LI-ONSITE