PCB Layout Engineer Accler8 Talent is partnering with an AI hardware company to hire an experienced PCB Layout Engineer to develop complex boards for high-performance computing systems. You’ll manage layout from initial planning through manufacturing release, with responsibility for dense component placement, high-speed interconnects, and high-current power distribution. The role involves close collaboration with hardware, packaging, and signal and power integrity engineers, alongside external manufacturing partners. You’ll also contribute to prototype bring-up and help resolve board-level issues. What You'll Do: • Lead PCB layout activities, including layer stack planning, impedance definition, component placement, routing, and production documentation. • Develop routing and breakout strategies for large, fine-pitch BGA devices. • Implement power distribution layouts for demanding current and thermal requirements. • Translate electrical and mechanical requirements into practical layout constraints, working with engineering teams to resolve tradeoffs. • Coordinate manufacturability and assembly reviews with PCB suppliers and manufacturing partners. • Support prototype evaluation, troubleshooting, and subsequent board revisions. • Improve layout productivity and design checks through scripting, automation, and new CAD capabilities. What You Bring: • 5+ years of PCB layout experience supporting complex computing, server, networking, or related hardware. • Strong experience with dense, multilayer boards carrying high-speed signals and substantial power loads. • Knowledge of controlled impedance, return-current paths, crosstalk mitigation, timing constraints, and via structures. • Proficiency with a professional PCB design platform such as Allegro, Xpedition, Altium, or a comparable tool. • Experience preparing and reviewing fabrication and assembly deliverables. • Ability to collaborate with signal integrity, power integrity, packaging, and systems engineers throughout the design cycle. What's Nice to Have: • Boards incorporating advanced semiconductor packaging, multi-die devices, or high-bandwidth memory. • Backplane or rigid-flex layout. • CAD scripting and workflow automation. • IPC design certification. • Direct coordination with PCB fabrication and assembly suppliers.