Thermo-Mechanical Engineer – Boston, MA (Onsite) I'm currently hiring for an early-stage semiconductor startup developing next-generation 3D heterogeneous integration technology. They're building advanced semiconductor systems that combine silicon, III-V materials and novel interposers into a single package, targeting applications across defense, aerospace, power electronics and future AI compute infrastructure. They're looking for an experienced Thermo-Mechanical Engineer who enjoys taking ownership of complex engineering challenges from first principles. This is a rare opportunity to join as a founding engineer, lead thermal and mechanical design from day one, and develop the simulation and reliability methodologies that will underpin an entirely new semiconductor integration platform. What they're looking for: • PhD with 2+ years or MS with 5+ years of relevant experience, or equivalent practical experience • Strong experience with thermal and structural FEA using ANSYS, COMSOL, Icepak or similar tools • Experience with advanced semiconductor packaging, heterogeneous integration or 3D stacked die • Strong understanding of thermal management, mechanical stress, warpage and reliability • Hands-on experience with thermal measurement, validation or advanced cooling technologies • Experience with package-level simulations, microbump fatigue or die-attach reliability is a strong plus Important details: • Fully onsite in Boston, MA • $150K–$220K base + founding-team equity Be sure to apply to find out more!