What We’re Looking For: We’re looking for engineers to contribute to the thermomechanical, electrical and mechanical design and assembly of the IO modules that attach to our A-0 and A-1 wafers. Ideal Background: • Deep understanding and hands-on experience with signal integrity signoff for copper and electro-optic connector interfaces • Hands-on experience with mechanical aspects of electrical and electro-optic connectors • Experience with bringup of connectorized links and systems Nice to Have: • Experience and understanding of sockets and socketed connectors • Experience with co-packaged copper and co-packaged optics • Experience with high density optical modules • Experience with XPO optical pluggable form factors