What We're Looking For: We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages. This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team. Ideal Background: • Experience with integrated photonics package assemblies with multiple dies • Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors • Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc. Nice to Have: • Experience with large device count photonic assemblies • Experience with clear underfill • Experience with high density fiber attach • Experience with large substrate size photonic MCM assemblies • Hands-on experience with PIC design