Texas Instruments' Advanced Technology Development team is looking for an energetic engineer with a passion for process development. This position provides the opportunity to enable new technologies for future Texas Instruments revenue growth. We are searching for a self-directed, highly motivated engineer to join our Lehi, UT Process Development team. The responsibilities of a Process Development Engineer in this role include: • Develop new processes and define processing and equipment requirements, specifications, and manufacturing methods for advanced semiconductor applications. • Influence process integration schemes and support technology development from early paper studies and pilot work through full-scale manufacturing. • Translate business unit roadmap requirements into pathfinding and process development projects. • Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications • Lead or support projects involving new process concepts, equipment selection, chemistry development, automation technologies, and novel manufacturing approaches. • Provide technical engineering support in manufacturing and drive process and equipment modifications that improve production efficiency, technical capability, and yield. • Develop and apply statistical methods, including Design of Experiments (DOE) and Statistical Process Control (SPC), to identify physical causes of yield loss and improve quality. • Partner with equipment suppliers and vendors to define and execute equipment and process development roadmaps. • Work across 300mm deposition platforms, including current single-wafer ALD and CVD systems. Minimum requirements: • Master’s degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field • 5+ years relevant experience in 300mm Advanced (<32nm) logic device or advanced memory device technologies • Working knowledge of Process development, characterization and control of Thin films processing equipment, CVD, PE-CVD, Single-wafer ALD • Strong supplier engagement skillset • Strong foundation in statistical process control, Design of Experiments (DOE), data analysis, model-based problem solving, engineering change control, and process release strategies Preferred qualifications: • 5 years relevant experience in 300mm Advanced logic of advanced memory device technologies: Specific experience on RMG products • Working knowledge of advanced CMOS device physics and reliability mechanisms • Hands on Process Experience across multiple 300mm deposition platforms for dielectric, High-K and Metals • Experience with Single-wafer ALD such as ASM XP4 Pulsar & XP8 platforms, as well as Batch ALD platforms • Familiarity with 300mm Semiconductor Single wafer Thermal, RTA, Laser Anneal systems • Direct R&D experience in 300mm semiconductors • Experience with HKMG, Silicon Photonics • Device physics training with understanding of materials, material evolution; structural characterization and electrical test characterization • Data analysis skills • Ability to work in teams and collaborate effectively with people in different functions and locations • Strong relationship-building, communication, time management, and results-oriented collaboration skills to enable on-time project delivery