Change the world. Love your job. We are seeking a highly motivated Advanced Process Development Engineer to join our Plasma Etch Process Development team. This role is responsible for developing, optimizing, and transferring advanced plasma etch processes supporting next-generation semiconductor technologies. The engineer will work closely with integration, equipment, metrology, and manufacturing teams to drive technology innovation, improve process capability, and enable successful product ramp into high-volume manufacturing. The ideal candidate possesses strong technical expertise in plasma etch fundamentals, semiconductor process development, statistical data analysis, and cross-functional problem solving. The responsibilities of a Manufacturing Development Process Engineer in this role include: • Process Development • Develop and optimize plasma etch processes for advanced semiconductor devices. • Design and execute experiments (DOE) to improve critical process metrics, including: • Etch rate • Selectivity • Critical dimension (CD) control • Profile control • Defectivity • Uniformity • Characterize process performance and establish process windows for manufacturing robustness. • Evaluate new process chemistries, hardware configurations, and chamber technologies. Technology Introduction • Support development and qualification of next-generation etch technologies. • Collaborate with device integration teams to meet product and technology requirements. • Drive process readiness for technology transfers from development into manufacturing. • Establish process specifications, control plans, and release documentation. Tool and Equipment Engineering • Partner with equipment engineering teams to improve tool capability, productivity, and reliability. • Lead chamber matching, equipment qualification, and process performance improvement activities. • Support installation and startup of new etch platforms. Data Analysis & Continuous Improvement • Analyze complex process datasets using statistical methods and data analytics tools. • Identify root causes of process excursions and implement corrective actions. • Lead yield improvement and defect reduction initiatives. • Utilize SPC methodologies to monitor and improve process stability. Cross-Functional Collaboration • Work closely with: • Process Integration • Manufacturing • Yield Engineering • Metrology • Equipment Engineering • Quality and Reliability teams • Present technical findings and recommendations to management and key stakeholders. • Mentor junior engineers and technicians as needed. Minimum requirements: • 8+ years of semiconductor plasma/dry etch process development experience. • Bachelors in an engineering discipline • Strong foundation in statistical process control, engineering change control and process release strategies • Experience with DOE methodologies and statistical analysis. • Familiarity with metrology techniques including SEM, CD-SEM, ellipsometry and defect inspection tools. Preferred qualifications: • Strong foundation in statistical process control, engineering change control and process release strategies • Proficiency with Python, Claude, or other AI models or tools is a plus • Demonstrated strong analytical and problem solving skills resulting in innovative and creative process solutions • Experience with process development and transfer on etch platforms (LAM, AMAT, TEL, etc) • Strong verbal and written communication skills • Ability to work in teams and collaborate effectively with people in different job functions • Strong time management skills that enable on-time project delivery • Demonstrated ability to build strong, influential relationships • Ability to work effectively in a fast-paced and rapidly changing environment • Ability to take the initiative and drive for result