The Yield, Device, and Integration Engineering Manager leads a multidisciplinary organization of device, yield, and integration engineers and technicians within a 300 mm semiconductor manufacturing environment. This role is accountable for electrical test governance, device disposition, and yield improvement across both fab and post-fab operations. Manage a team responsible for analyzing electrical test data—including inline parametric results and wafer probe performance—to drive device capability, product quality, and proactive excursion prevention. The role defines and implements advanced electrical test screens, improves mean-time-to-detect signals, and ensures the factory maintains best‑in‑class electrical performance standards. Success requires strong cross‑functional partnership with integration, technology development. module engineering, production, wafer probe & inline test, product engineering, and final test (ATO) teams across the company. The manager also owns the governance framework for line yield and leads continuous improvement initiatives that enhance quality, cost, and productivity. Essential Responsibilities • Lead, coach, and develop a team of device, yield, and integration engineers and technicians. • Analyze electrical test and device performance data to drive continuous improvement in yield, quality, cost, and productivity. • Partner closely with production, module engineering, wafer probe engineering, product engineering, and final test organizations to align on device and yield priorities. • Drive yield improvement programs that achieve industry‑competitive performance benchmarks. • Own governance and reporting of line yield across fab and post‑fab operations; implement targeted corrective actions. • Ensure audit readiness and full compliance with electrical test quality systems and standards. • Achieve and maintain Cp/Cpk requirements for all critical electrical performance metrics. • Utilize offline bench testing and laboratory resources to diagnose electrical failures and resolve device issues. • Champion a strong safety culture and ensure compliance with all Environmental, Health, Safety & Security (EHSS) requirements. Required Qualifications • B.S. in Electrical Engineering, Solid State Physics, or a related engineering field. • Minimum 10 years of experience in semiconductor device engineering, yield improvement, or integration/module/product engineering. • Minimum 10 years of experience in high-volume semiconductor manufacturing. • People management experience Preferred Qualifications • M.S. in Electrical Engineering, Solid State Physics, or related field. • Expertise in semiconductor parametric and functional test, characterization, and device physics. • Strong understanding of semiconductor manufacturing metrics and structured problem‑solving methodologies. • Experience in high‑volume fab operations and global, matrixed organizational environments. • Excellent written and verbal communication skills, with demonstrated ability to communicate effectively across all organizational levels and with external partners. • Proven ability to manage multiple priorities, meet commitments, and deliver results under shifting business needs. • Familiarity with 5S, 8D, Six Sigma, SPC, DOE, FMEA, DPAT, SBL, and statistical yield analysis tools. onsemi is excited to share the base salary range for this position is $127,800-$217,200 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf