Salary: $ 170,000.00 We have partnered with a semiconductor manufacturing firm in the San Jose, CA area to provide them with a Senior Staff Packaging Engineer. Please review the below description and let us know if you are interested. Prioritized Must Have Skills for the Senior Staff Packaging Engineer: #1. Minimum of 12 years experience in semiconductor packaging technology. #2. Experience leading multi-die packages. #3. Organic laminate technologies manufacturing and supplier capabilities. Responsibilities of the Senior Staff Packaging Engineer: • Responsible for defining substrate/package design rules, process flow and material set for new automotive power module packages • Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules • Develop new assembly technologies, run process DOEs, to define process windows for new package development • Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group • Work closely with offshore assembly and substrate partners to develop new processes • Work closely with IC design teams to define package design rules and define packages to meet their requirements • Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products Requirements of the Senior Staff Packaging Engineer: • BS Degree in Electrical Engineering, Mechanical Engineering, Material Science. • Minimum experience 12 years in semiconductor packaging technology. • Experience leaded multi-die packages. • Understanding of organic laminate technologies manufacturing and supplier capabilities. • Experience in SMT or passive integrated package assembly is a plus. • Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus) • Experience with package substrate design rules, tools (including AutoCAD). • Knowledge of AEQ Automotive reliability requirements. • Knowledge of APQP automotive development process • Knowledge of JEDEC/IPC design standards. • Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus. • Travel to Asia to attend technology reviews and resolve subcon/supplier issues Other Key Requirements: • 100% in office • Must be able to travel to Asia. • No sponsorship or Visa holders. No Corp-to-Corp. Benefits of the Senior Staff Packaging Engineer: • Medical Insurance • Dental Insurance • Vision Insurance • Short- & Long-Term Disability Insurance • 401(k) Plan About the Company: Cyfle is a global business dedicated to connecting talents worldwide. Our comprehensive RPO services, placement services, and training services help businesses unlock their full potential.