Thinning Process Engineer Job Description: Thinning Process Engineer responsible for sustaining existing processes and developing new Grind and Polish processes in the wafer fab located in Lowell, MA. Product lines include GaAs ICs, InP lasers and detectors, Si transistors, and others. Specific responsibilities include: Daily sustaining of the Thinning area to ensure all factory indicators are met, continuous improvement of the processes and procedures, and developing new processes for new products, product transfers, and new process capabilities for foundry operations. Sustaining and continuous improvement include, but are not limited to: quality, reliability, cost, yield, process stability/capability, productivity, and safety.