Packaging Engineer Intern Job Description: The packaging engineering group of MACOM supports the design, development, and implementation of packaging solutions for RF semiconductor devices. Interns may assist in package design work and in creating / reviewing assembly drawings using CAD software. They may collect data directly or coordinate work with external labs, using metrology and failure analysis tools and techniques. They may help design experiments and analyze results using statistical techniques and process improvement methodology. Interns may also, depending on skill level, run thermal and mechanical simulations with FEA software packages to characterize new materials and device designs. Interns will periodically need to put together reports of work and present to other engineers and management.