Partner with Design Engineering throughout the product development lifecycle, reviewing circuit and layout designs to ensure compliance with design standards, manufacturability requirements, and quality objectives while driving continuous design improvements Lead product and process characterization activities to validate performance against datasheet specifications, identify enhancement opportunities, and initiate re-characterization or process optimization efforts as required Support high-volume manufacturing operations by ensuring accurate production documentation, monitoring process performance and yield metrics, managing lot dispositions, and driving continuous cost and efficiency improvements Serve as the primary technical resource for product quality and reliability, conducting root cause analysis on customer returns, resolving process-related issues, investigating yield excursions, and implementing corrective and preventive actions Oversee product development, test, and packaging initiatives, including new package introductions, test program maintenance, flow optimization, test-time reduction, and performance enhancement activities Provide technical leadership and cross-functional collaboration by mentoring junior engineers, guiding process and quality improvement programs, and contributing to strategic engineering projects and business objectives Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related discipline, with 2+ years of experience in the semiconductor industry Strong technical expertise in non-volatile memory technologies, including NOR and/or NAND Flash architectures, cell operation, and product design implementation, with a solid understanding of New Product Introduction (NPI) processes and milestones Comprehensive knowledge of semiconductor manufacturing processes, including wafer fabrication, wafer probe testing, assembly, and final electrical test, with an understanding of their impact on datasheet compliance, yield performance, and quality metrics Experience with device and package-level reliability testing, failure mechanisms, and associated reliability stress methodologies, along with the ability to correlate application requirements and datasheet specifications to automated test programs Proficiency in statistical data analysis and automation tools, including JMP, Yield3, and programming/scripting languages such as Python, C/C++, or Perl, with experience leveraging coding and AI-based tools for engineering analysis and test optimization Hands-on experience with semiconductor test and validation environments, including bench characterization equipment (oscilloscopes, logic analyzers, parameter analyzers) and Automated Test Equipment (ATE) platforms such as Teradyne and Advantest, complemented by excellent verbal, written, and interpersonal communication skills We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. Prathap Bhavapuram