Develop 300 mm front-end Cu metallization and pad technologies for GaN-based power semiconductor applications, from process concept to transfer into production Take on project leadership responsibilities for BEOL technology development activities in Dresden and support ambitious project plans to accelerate time-to-market Drive the development and implementation of metallization concepts with a focus on stability, yield, reliability, and manufacturing costs Collaborate closely with process development engineers to define, implement, and optimize process requirements Work in multinational and cross-site development teams, with project management based in Villach, Austria, and team leadership in Regensburg, Germany A university degree in Microsystems Engineering, Electrical Engineering, Physics, or a related scientific or engineering discipline At least 5 years of relevant experience in process technology development and/or process integration, ideally within semiconductor metallization Proven skills in technical leadership and project management A high level of initiative, ownership, and motivation Strong communication and collaboration skills in international environments Fluency in both German and English, with the ability to communicate and present effectively in both languages We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. Nicole Hippmann