Lead engineering activities for Molding / Mark, Trim & Form / Die Attach and Clip Attach / Final Test, Scan and Packing processes for SON product Drive process optimization to improve test yield, quality, productivity, equipment utilization, and manufacturing cost Lead process & equipment qualification and process characterization. Bachelor's Degree, Master's degree or PhD in Engineering (Electrical, Electronics, Mechanical, Materials, Manufacturing, Physics, Computer or related discipline) o Mold : Transfer Molding processes, BESI, ASM and Asahi equipment. o Mark, Trim & Form : Marking Processes, Trim & Form operations, BESI and ASM equipment, TDSON or similar leadframe-based packages. o Die Attach / Clip Attach : Die Attach process or similar leadframe packages, Clip Attach Technology, Solder Paste and reflow processes, ASM Die Bonder platforms, Knowledge of leadframe-based power package assembly processes. o Final Test, Scan and Pack : Final Test operations, ETS88 Test Systems, SRM (Scan and Reel Module) processes, ExisTech Handler platforms. o Die Attach / Clip Attach - Expertise in ASM AD series Die Bonders or equivalent platforms - Experience with solder paste, clip attach, and power package assembly technologies - Familiarity with TDSON, STOLL or similar leadframe-based packages. o Final Test, Scan and Pack - Experience with ETS88 test platform development, optimization, and troubleshooting - Strong knowledge of handler-test cell integration and automation systems. Ability to work effectively in a cross-functional and multinational environment. WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.