Project Management: Lead design, material selection, qualification, and new product introduction for the HiRel Package Group Process Development: Manage projects through prototype builds, learning cycles, and qualification builds Compliance: Ensure designs meet quality and reliability criteria for HiRel applications Design Rules: Develop and sustain design rules, including Design for Manufacturing (DFM) standards Collaboration: Partner with the package design team to release robust and reliable packages to production Team Development: Promote a culture of collaboration, innovation, and resilience within the packaging team Education: Graduating in the Spring 2027 with a Masters or PhD in Mechanical Engineering, Material Science, Chemical Engineering, or a related field Technical Expertise: Knowledge of process flows, upstream and downstream interactions, and design of experiments (DOE) Problem-Solving Skills: Ability to identify unexpected issues, drive root-cause analysis, and persevere until closure Data Analysis: Experience in data analysis and continuous process improvement Soft Skills: Strong communication and leadership skills, with the ability to work collaboratively as a team player and self-starter US citizen or green card holder: This position requires access to documentation that is controlled by the export laws of the United States. We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.