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Staff Process Engineer, APTD Bonding

Micron Technology · micron.com
BoiseLead / Manager5+ yrs
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Subscribers got this job on 12 October 2026. New jobs reach them at 8 am and 6 pm, 5 days before they open here. Get the next one first

The job in short

Advanced packaging bonding process engineering.

Audit

Details

Found
20 d ago · posted 2026-08-28
Location as listed
Boise, ID,US, US
Role
Chemical / Process Engineer
Source
The company’s own careers site

Full description

Req ID: JR100411 Staff Process Engineer, APTD Bonding Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Position Overview: As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Responsibilities: * Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods * Identify, diagnose, and resolve assembly process related problems * Coordinate and complete process, equipment, and material evaluation / optimization initiatives and implement changes at process step * Validate and fan out new process baseline qualified, including new process, tools, and/or materials for new product introduction * Support SPC/FDC/RMS/APC, and site-to-site portability * Audit material suppliers to achieve quality, cost and risk management objectives Minimum Qualifications: * BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics + 5 years of relevant industry experience * Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products * Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis and data analysis * Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions * Ability to resolve sophisticated issues through root-cause or model-based problem solving and adjust to shifting responsibilities and needs of the team. Preferred Qualifications: * MS or PHD in Materials Science, Chemical Engineering, Electrical Engineering, or Mechanical Engineering * Experience leading project teams and providing leadership updates * Experience building relationships with suppliers/vendors Job Profile(s): Semiconductor Process Engineer 4 Relocation Level: TBD Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [email protected] or 1-800-336-8918 (select option #3)

Chemical / Process Engineer jobs in Boise, Idaho · Chemical / Process Engineer jobs in the United States · All Micron Technology jobs

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