Lead end-to-end planning and execution for electrical engineering initiatives, including PCB and/or superconducting integrated circuits development, validation, integration, sustaining activities, program schedules, critical paths, risk mitigation, and cross-team dependencies. Drive complex PCB supplier and manufacturing engagements by coordinating capability assessments, technical reviews, readiness evaluations, process development, stack-ups, design rules, yield improvement, cost optimization, and performance tracking. Partner across qubit design, electrical engineering, mechanical engineering, systems engineering, reliability, sourcing, supply chain, fabrication partners, contract manufacturers, system integrators, and leadership teams to align deliverables, resolve blockers, and support high-quality execution. Develop and improve electrical and PCB development processes, documentation, quality frameworks, design review practices, design for manufacturing, testability, and validation workflows, manufacturing readiness processes, dashboards, and reporting mechanisms. Own program budget, resource, and portfolio planning for assigned efforts, including build costs, vendor non-recurring engineering, capital needs, engineering resource forecasts, cost scenario modeling, actuals tracking, and alignment to fiscal expectations. Bachelor's Degree in Physics, Engineering, or related field AND 6+ years experience in industry or in a research and development environment OR Master's Degree in Physics, Engineering, or related field AND 4+ years experience in industry or in a research and development environment OR Doctorate in Physics, Engineering, or related field AND 1+ year(s) experience in industry or in a research and development environment, could include completion of a post doctoral research position OR equivalent experience. Ability to work in an “AI-first” environment using modern AI tools to accelerate discovery through both hardware and software development. Ability to use and help build AI agents/copilots that assist with experimental workflows — e.g., instrument configuration, maintenance tracking, safety/readiness checklists, protocol templating, logbook summarization, and knowledge retrieval from instrument manuals, install guides, and configuration documentation. 10+ years of experience in engineering program management, hardware development, technical leadership, or a related field, with a track record of delivering complex cross-functional programs from concept to production. Experience working directly with PCBs and/or superconducting integrated circuit design teams, fabrication vendors, electronics manufacturing services and contract manufacturers (EMS/CMs), and external suppliers. Deep understanding of electrical engineering fundamentals, including PCB stack-ups, superconducting integrated circuits, signal integrity, power delivery, and manufacturing constraints. Experience in advanced hardware domains such as quantum systems, high-performance computing, or complex embedded systems. Familiarity with design for manufacturing and design for test (DFM/DFT), process development, and early-stage technology maturation. Experience building project schedules, managing budgets, planning resources, and partnering across matrixed teams. Ability to manage supplier performance, support technical engagements, and drive accountability across internal and external stakeholders. Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation). Ability to work in an “AI-first” environment using modern AI tools to accelerate discovery through hardware development.