Overview: Responsible for managing a small group of engineers in charge of all aspects of packaging for MACOMs Lightwave products. Including TO-cans, TOSA/ROSA, Chip on Carrier, etc. Oversee all packaging development activities, while driving continuous improvement and supporting the sustaining of existing technologies. This position requires a strong understanding of packaging fundamentals as well as strong leadership and communication skills. Responsibilities: Serve as the primary interface for package design and improvements, between external suppliers and internal design teams for the entire Lightwave BU. Work closely with MACOM multi-functional teams to provide guidance on correlation of package design architecture to assembly process constraints and help with solving issues and resolving yield and reliability problems as they come along. Delivering appropriate design rule decks and lead DFM/DFR activities, lead substrate fabrication, package assembly and package qualification with external partners and suppliers Collaborate with the photonics design team to optimize performance, reliability and manufacturability. MACOMs existing TO-can engineers in Taiwan and China will report to KC. Design/develop new packaging techniques to support new product introduction. Drive yield improvement Improve and develop strong process controls with MACOMs contract manufacturer’s in Asia Coaching/Mentoring process engineers. Help drive mentality of true root cause analysis and identify permanent solutions. Aid in cost reduction for LW packaging solutions. Work with Manufacturing to improve and streamline existing processes for increased accuracy and efficiencies.