Build quantum devices by drawing on expertise of a large range of nano-fabrication techniques and work with other technical owners to understand the impact of process conditions on device performance. Conduct experiments to create and improve fabrication processes and use quantitative characterization and metrology to establish process windows, identify failure mechanisms, and improve process repeatability and yield. Partner closely with device physicists, materials scientists, growth engineers, characterization teams, and other fabrication engineers to identify factors that impact quantum devices and translate device requirements into practical fabrication processes. Help develop tools needed for improving fabrication by identifying process and equipment capability gaps and assisting with equipment upgrades and process improvements for addressing those gaps. Actively participate in the collection of fabrication and characterization data to maintain and improve processes and to identify opportunities for improved device performance, reliability, repeatability, and yield. Other Apply AI to accelerate engineering and lab workflows. Design and build AI agents/copilots that assist with experiment setup, log triage, measurement report generation, protocol templating, and knowledge retrieval (e.g., instrument manuals, design docs) Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience These requirements include, but are not limited to the following specialized security screenings: Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation). Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience OR equivalent experience 8+ years of hands-on experience of independently developing semiconductor, superconducting, MEMS, photonic, or other advanced micro- or nanofabrication processes. 8+ years of hands-on experience with electron-beam lithography or advanced optical lithography. 8+ years of hands-on experience with thin-film deposition techniques such as atomic layer deposition, e-beam evaporation, sputtering, or chemical vapor deposition. Experience developing plasma etch processes - ion-mill, reactive ion etch, and/or atomic layer etch - for sensitive nanoscale devices. Experience with III-V semiconductor processing and gate dielectric depositions on III-Vs.