Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. As the Technical Engineering Lead in Hardware Engineering, you will pioneer innovative, high-impact engineering solutions, mentor and develop a team to deliver efficiencies for the next generation of Google’s data center infrastructure. You will provide cross-functional leadership, partnering with multidisciplinary teams of electrical, mechanical, firmware, software, and thermal engineers. You will drive an end-to-end technical strategy, identifying high-value opportunities, guiding executive decision-making, and delivering transformative programs from concept to global deployment. You will be navigating complex ambiguity, fostering technical excellence, and making data-motivated decisions that shape foundational infrastructure. Our Platforms Infrastructure Engineering team designs and builds the hardware and software technologies that power all of Google's services. Our computational challenges are complex and unique, enabled by cutting-edge custom hardware designed and made in-house. As a hardware engineer, you will design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You will see those systems from concept all the way through to high-volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers, affecting millions of Google users. Individual pay is determined by factors including job-related skills, experience, and relevant education or training. US: $188000 - $274000 (USD) + 20% bonus target + equity + benefits Learn more about benefits at Google. Responsibilities • Drive end-to-end system architecture, technology roadmap, and board-level design for next-generation platforms, establishing technical direction and design standards. • Lead multi-disciplinary trade-off analyses across system, mechanical, thermal, and PCB layout teams to define high-density interconnect strategy, stackup architecture, and routing guidelines. • Architect Power Delivery Networks (PDN) and high-speed signal pathways with SI/PI experts, establishing guidelines that ensure robust performance at hyperscale. • Lead execution and technical design reviews with JDM/CM partners, implementing engineering changes to accelerate project delivery. • Lead cross-functional engineering initiatives with Silicon, Firmware, Software, Thermal, Mechanical, and Operations teams to deliver cohesive, scalable infrastructure solutions. Influence manufacturing and vendor roadmaps to optimize design for manufacturing and design for test for high-volume, enterprise-grade deployments. Minimum qualifications: • Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or equivalent practical experience. • 6 years of experience working in a hardware systems development environment. • Experience in full product life cycle from design through deployment. • Experience leading JDM/CM partnerships and design review. • Experience driving system level architecture. Preferred qualifications: • Master’s degree in Business Administration, Electrical Engineering, Mechanical Engineering, Physics, or a related field. • 10 years of engineering experience, with an understanding of data center technical environments. • Experience with data center equipment development. • Experience managing eCAD tools, workflows development. • Experience managing a technical team. • Experience overseeing lab validation strategy, hardware system bring-up, and root-cause analysis for complex debugging.