At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues. What you'll be doing: * Lead adhesive and bonding process development for advanced FCBGA packaging, including surface preparation, surface coatings and process optimization for applications requiring optical alignment and high dimensional stability. * Design and execute Design of Experiments (DOE) for adhesive material qualification, process window definition, and process optimization including failure analysis. * Evaluate and qualify new materials (adhesives, encapsulants, underfills) from vendors including characterization of cure chemistry, thermal stability, and mechanical properties * Define and own incoming material acceptance criteria and statistical process control (SPC) thresholds for production readiness * Collaborate with partners and material suppliers to resolve process escapes, drive 8D corrective actions, and align on specification requirements * Prepare process documentation, assembly specs, and material qualification reports * Monitor and analyze production data to identify process trends, drive yield improvements, and ensure ongoing process control across OSAT manufacturing sites. What we need to see: * B.Sc. or M.Sc. in Materials Science, Chemical Engineering, or a related field * 7+ years of experience in process engineering, with hands-on expertise in adhesive process development. * Proven experience with failure analysis techniques: cross-sectioning, SEM/EDX, optical microscopy, DSC, TGA, and FTIR * Willingness and ability to travel internationally approximately 30% of the time to support OSAT partners, supplier qualifications, and on-site failure investigations * Ability to work independently in a fast-paced, multi-program environment * Curious and creative problem solver as well as organized and multi-tasker * Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written) * High awareness of quality, manufacturability and project schedule Ways to stand out of the crowd: * Proven record in packaging development * Background in semiconductor manufacturing processes and optical systems