For 80 years, Murata Electronics has been a tireless innovator, committed to developing technologies that profoundly change the world around us. Our solutions are inside more state-of-the-art products than you may imagine. Additionally, we enable other global companies to turn their visions into reality – from mobile communications to computers and networking, medical devices to power solutions, smart home technologies to automotive electronics. Our past innovations drive today's technology – and our present innovations are shaping tomorrow's. Whatever the future holds, you can be sure that Murata will be a part of it. Why Consider This Job Opportunity The Senior Power Engineer leads technical marketing for next generation AI data center power delivery from PDB/IBC through package/on-die delivery networks. Work directly with customers and internal engineering teams to translate emerging system challenges into quantitative requirements, technology roadmaps and new R&D initiatives. Workplace Policy Hybrid from San Jose, CA. What To Expect (Essential Job Responsibilities) • Analyze end to end AI server power delivery from rack/PDB and 48V IBC stages through multiphase VRs, PoL converters, and integrated regulators. • Translate customer needs into quantitative electrical, thermal, mechanical including voltage, current efficiency, power density, transient response. • Identify the system-level problem behind customer component specifications. • Create and advance design-in, joint-evaluation, and co-development opportunities by connecting customer roadmaps with internal product and R&D capabilities. • Serve as the technical interface among customers, sales, product divisions, corporate R&D, and external partners; proactively initiate communication to obtain required information and drive decisions. Miscellaneous Job Responsibilities • Monitor emerging technologies and ecosystem changes, including 800 VDC rack distribution, vertical power delivery, TLVR, switched-capacitor and hybrid converters, IVR, backside power delivery, glass-core substrates, through-glass vias, embedded power components, and advanced cooling. • Build relationships with universities, startups, semiconductor companies, packaging suppliers, and research institutes to identify collaboration and innovation opportunities. • Support predominantly virtual collaboration with sales, technical support, and customer teams across Dallas, San Jose, and other U.S. and global locations; travel as required for customer and partner engagements. • Perform other related duties and support cross-functional initiatives as assigned. This position is currently intended as an individual-contributor role with no direct supervisory responsibility unless otherwise assigned. What Is Required (Qualifications) • Bachelor’s degree in electrical engineering, Power Electronics, Semiconductor Engineering, Electronic Packaging, or a closely related technical field. • 5+ of relevant industry experience in power electronics, server/data center power architecture, board- or package-level PDN/power integrity, semiconductor power applications, power modules, magnetics, or passive components. • Strong understanding of DC-DC power conversion, including buck and multiphase converters; working knowledge of IBC, POL, switched-capacitor, coupled-inductor, or related architectures. • Working knowledge of target impedance, decoupling, voltage droop, transient response, and parasitic resistance and inductance across board and package interconnects. • Ability to convert customer needs into measurable technical requirements, product specifications, technical proposals, or development plans. • Strong communication and presentation skills with the ability to engage circuit designers, package • engineers, system architects, commercial teams, and senior leadership. • Ability to work independently, initiate cross-site communication, and lead projects across organizational and geographic boundaries. How To Stand Out (Preferred Qualifications) • Master's degree or Ph.D. in Electrical Engineering, Power Electronics, Semiconductor Engineering, Electronic Packaging, or a related field. • Experience with Hyperscalers, AI accelerator companies, server OEMs/ODMs, power solution suppliers, or advanced packaging organizations. • Experience with 48 V/54 V power delivery, high-voltage DC distribution, TLVR, vertical power delivery, IVR, hybrid converters, or processors operating above 1 kW or at kiloampere-class current levels. • Knowledge of advanced packages, interposers, glass-core substrates, TGV, embedded passives, backside power delivery, thermal design, or liquid cooling. • Previous technical marketing, product management, field applications, new product definition, customer co-development, design-in, or design-win experience. Other Infrequent domestic and international travel. Minimum Salary: $97,894 Maximum Salary: $162,259 Perks • Comprehensive benefits package including medical, dental, and vision insurance. • Generous Paid Time Off including paid holidays and floating holidays. • 401(k) employer match on retirement planning. • Hybrid working schedule for eligible positions. • Tuition reimbursement on approved programs. • Flexible and health spending accounts. • Talent Development program. Imagine the possibilities as a member of Murata's innovative global team. Be an innovator - Join Murata! Murata offers competitive compensation and comprehensive benefits. Equal Opportunity/Affirmative Action Employer - M/F/Disabilities/Veterans