You bring experience in quantum device design and radio-frequency (RF) simulation, familiarity with integrated circuit design workflows and tool development, and a passion for advancing quantum computing. Clear communication and effective interdisciplinary collaboration are central to this role. With a growth mindset culture, we innovate responsibly and measure success by shared progress—people, teams, and customers. Join us to do meaningful work that changes the world and helps shape what's next for everyone. Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience These requirements include, but are not limited to the following specialized security screenings: Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable. Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience OR equivalent experience 3+ years of experience in chip or printed circuit board (PCB) design involving quantum devices, mixed-signal integrated circuits, high-speed RF/digital circuits, or equivalent relevant experience. Proficiency with industry-standard or custom chip and circuit design tools, including electronic design automation (EDA) tools for integrated circuit (IC), application-specific integrated circuit (ASIC) design, physical design, and verification. Experience with RF circuit and electromagnetic simulation for device, chip, and interconnect modeling and optimization, using tools such as Ansys, Sigrity, COMSOL, Cadence, or Simulation Program with Integrated Circuit Emphasis (SPICE)-based simulators. Experience with device and chip thermal modeling, preferably in quantum or cryogenic operating regimes, using Ansys, COMSOL, or custom modeling packages. Experience with semiconductor device design and fabrication processes, including process design kits (PDKs), along with Python programming and collaborative development using Git/GitHub. Knowledge of quantum computing principles and hands-on quantum hardware experience, such as superconducting-qubit or spin-qubit systems. Ability to work in an “AI-first” environment using modern AI tools to accelerate discovery through both hardware and software development. Design and build AI agents/copilots that assist with experiment setup, log triage, measurement report generation, protocol templating, and knowledge retrieval (e.g. instrument manuals, design docs). Device Design: Develop QPU chip designs and interfaces to readout/control layers using simulation-driven, fabrication-aware workflows. RF Simulation: Perform RF simulations of QPU chips and interface layers to define design requirements and optimize control/readout performance. Cross-Team Collaboration: Partner with fabrication, systems, packaging, and control teams to co-design QPUs, incorporating constraints and requirements. Tool Development: Build and maintain design tools, functionalize devices into models, and enable co-design with internal teams and external partners. Process Optimization: Apply integrated circuit design principles and engineering best practices to improve design processes and recommend optimizations.